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SoCC2022

This project is based on a collaboration between the reconfigurable space computing labratory at California State University, Pomona and the Intelligence Circuits, Architecture, and Systems (iCAS) labratory at Shanghai Jiao Tong University and University of Illinois at Urabana-Champaign.

If you use this code, please cite:

Wei, X., El-Hadedy, M., Mosanu, S., Zhu, Z., Hwu, W. M., & Guo, X. (2022, September). Reco-hcon: A high-throughput reconfigurable compact ascon processor for trusted iot. In 2022 IEEE 35th International System-on-Chip Conference (SOCC) (pp. 1-6). IEEE.

	@inproceedings{wei2022reco,
		title={Reco-hcon: A high-throughput reconfigurable compact ascon processor for trusted iot},
		author={Wei, Xiangdong and El-Hadedy, Mohamed and Mosanu, Sergiu and Zhu, Zhengping and Hwu, Wen-Mei and Guo, Xinfei},
		booktitle={2022 IEEE 35th International System-on-Chip Conference (SOCC)},
		pages={1--6},
		year={2022},
		organization={IEEE}
	}

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