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Bogdan Bogush edited this page Apr 18, 2021 · 1 revision

Add new parallel NAND chip

Open Settings - Parallel chip database and add chip parameters from datasheet.
  • Name - name of chip.
  • Page Size - page size in bytes without spare area (hexadecimal).
  • Block Size - block size in bytes without spare area (hexadecimal).
  • Total Size - total size in bytes without spare area (hexadecimal).
  • Spare Size - spare size in bytes (hexadecimal).
  • BB mark off. - the offset of byte in the spare area which contains bad block mark. The block is considered as bad if the byte contains non 0xFF value. The offset starts from 0.
  • tCS - Chip Enable (CE) setup time (ns).
  • tCLS - Command Latch Enable (CLE) setup time (ns).
  • tALS - Address Latch Enable (ALE) setup time (ns).
  • tCLR - Command Latch Enable (CLE) to Read Enable (RE) delay (ns).
  • tAR - Address Latch Enable (ALE) to Read Enable (RE) delay (ns).
  • tWP - Write Enable (WE) pulse width (ns).
  • tRP - Read Enable (RE) pulse width (ns).
  • tDS - Data setup time (ns).
  • tCH - Chip Enable (CE) hold time (ns).
  • tALH - Address Latch Enable (ALE) hold time (ns).
  • tWC - Write cycle time (ns).
  • tRC - Read cycle time (ns).
  • tREA - (RE) access time (ns).
  • Row cycles - number of clock cycles required to program row address.
  • Col. cycles - number of clock cycles required to program column address.
  • Read 1 com. - command to read page 1st clock cycle (hexadecimal).
  • Read 2 com. - command to read page 2nd clock cycle (hexadecimal). Optional (-).
  • Read spr. com. - command to read spare area (hexadecimal). Optional (-).
  • Read ID com. - command to read chip ID (hexadecimal).
  • Write 1 com. - command to program page 1st cycle (hexadecimal).
  • Write 2 com. - command to program page 2nd cycle (hexadecimal). Optional (-).
  • Erase 1 com. - command to erase block 1st cycle (hexadecimal).
  • Erase 2 com. - command to erase block 2nd cycle (hexadecimal). Optional (-).
  • Status com. - status command (hexadecimal).
  • ID1 - 1st chip ID - manufacturer (hexadecimal).
  • ID2 - 2nd chip ID - device ID (hexadecimal). Optional (-).
  • ID3 - 3rd chip ID (hexadecimal). Optional (-).
  • ID4 - 4th chip ID (hexadecimal). Optional (-).
  • ID5 - 5th chip ID (hexadecimal). Optional (-).

Example Samsung K9F1G08U0E:










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