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Adjusted solderstop webbing min width.
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esden committed Jan 11, 2020
1 parent 06ade62 commit b445454
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Showing 2 changed files with 8 additions and 8 deletions.
12 changes: 6 additions & 6 deletions dvi-24bit/v1.0a/dvi-24bit.kicad_pcb
Original file line number Diff line number Diff line change
Expand Up @@ -72,7 +72,7 @@
(pad_size 1.7 1.7)
(pad_drill 1)
(pad_to_mask_clearance 0.01)
(solder_mask_min_width 0.25)
(solder_mask_min_width 0.05)
(aux_axis_origin 70 60.6)
(grid_origin 30 40.2)
(visible_elements FFFFFF1F)
Expand Down Expand Up @@ -2499,7 +2499,7 @@
(segment (start 37.89 49.1) (end 38.69999 48.29001) (width 0.15) (layer F.Cu) (net 48))
(segment (start 35.31 49.1) (end 37.89 49.1) (width 0.15) (layer F.Cu) (net 48))

(zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5BAA26D2) (hatch edge 0.508)
(zone (net 1) (net_name GND) (layer F.Cu) (tstamp 5E1AB737) (hatch edge 0.508)
(connect_pads (clearance 0.15))
(min_thickness 0.15)
(fill yes (arc_segments 16) (thermal_gap 0.15) (thermal_bridge_width 0.2))
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)
)
)
(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5BAA26CF) (hatch edge 0.508)
(zone (net 1) (net_name GND) (layer B.Cu) (tstamp 5E1AB734) (hatch edge 0.508)
(connect_pads (clearance 0.15))
(min_thickness 0.15)
(fill yes (arc_segments 16) (thermal_gap 0.15) (thermal_bridge_width 0.2))
Expand Down Expand Up @@ -4032,7 +4032,7 @@
)
)
)
(zone (net 2) (net_name +3V3) (layer In1.Cu) (tstamp 5BAA26CC) (hatch edge 0.508)
(zone (net 2) (net_name +3V3) (layer In1.Cu) (tstamp 5E1AB731) (hatch edge 0.508)
(connect_pads (clearance 0.15))
(min_thickness 0.15)
(fill yes (arc_segments 16) (thermal_gap 0.15) (thermal_bridge_width 0.2))
Expand Down Expand Up @@ -4569,7 +4569,7 @@
)
)
)
(zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5BAA26C9) (hatch edge 0.508)
(zone (net 1) (net_name GND) (layer In2.Cu) (tstamp 5E1AB72E) (hatch edge 0.508)
(connect_pads (clearance 0.15))
(min_thickness 0.15)
(fill yes (arc_segments 16) (thermal_gap 0.15) (thermal_bridge_width 0.2))
Expand Down Expand Up @@ -5082,7 +5082,7 @@
)
)
)
(zone (net 50) (net_name /3V3x) (layer In1.Cu) (tstamp 5C4DC4B7) (hatch edge 0.508)
(zone (net 50) (net_name /3V3x) (layer In1.Cu) (tstamp 5E1AB72B) (hatch edge 0.508)
(connect_pads (clearance 0.15))
(min_thickness 0.15)
(fill yes (arc_segments 16) (thermal_gap 0.15) (thermal_bridge_width 0.2))
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4 changes: 2 additions & 2 deletions dvi-24bit/v1.0a/dvi-24bit.pro
Original file line number Diff line number Diff line change
@@ -1,4 +1,4 @@
update=Sat 11 Jan 2020 04:15:41 PM CET
update=Sat 11 Jan 2020 04:20:31 PM CET
version=1
last_client=kicad
[general]
Expand Down Expand Up @@ -68,7 +68,7 @@ OthersTextSizeThickness=0.15
OthersTextItalic=0
OthersTextUpright=1
SolderMaskClearance=0.01
SolderMaskMinWidth=0.25
SolderMaskMinWidth=0.05
SolderPasteClearance=0
SolderPasteRatio=-0
[pcbnew/Layer.F.Cu]
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