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First commit of functioning DRU
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hattesen committed Oct 19, 2023
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29 changes: 29 additions & 0 deletions .gitignore
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## KiCad 7 - https://www.kicad.org/

## KiCad temporary files
# eg: ~PROJECT.kicad_sch.lck
~*.kicad_???.lck
# eg: .~lock.PROJECT.csv#
.~lock.*#
\#auto_saved_files#
fp-info-cache

## KiCad backup directories and files
# eg: PROJECT-backups/ (contains PROJECT-YYYY-MM-DD_hhmmss.zip files)
*-backups/
# eg: PROJECT.kicad_sch-bak PROJECT.kicad_pcb-bak
*.kicad_???-bak
# eg: PROJECT.kicad_sch.bak SYMBOL-LIB.kicad_sym.bak
*.bak

## KiCad local settings
# eg: PROJECT.kicad_prl
*.kicad_prl

## Non-KiCad files and directories
# Always ignore tmp directories and their contents
tmp/
# MacOS stuff
.DS_Store


132 changes: 132 additions & 0 deletions JLCPCB/JLCPCB.kicad_dru
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(version 1)
# Custom Design Rules (DRC) for KiCAD 7.0 (Stored in '<project>.kicad_dru' file).
#
# Matching JLCPCB capabilities: https://jlcpcb.com/capabilities/pcb-capabilities
#
# KiCad documentation: https://docs.kicad.org/master/id/pcbnew/pcbnew_advanced.html#custom_design_rules
#
# Inspiration
# - https://gist.github.com/darkxst/f713268e5469645425eed40115fb8b49 (with comments)
# - https://gist.github.com/denniskupec/e163d13b0a64c2044bd259f64659485e (with comments)

# TODO new rule: NPTH pads.
# Inner diameter of pad should be 0.4-0.5 mm larger than NPTH drill diameter.
# JLCPCB: "We make NPTH via dry sealing film process, if customer would like a NPTH but around with pad/copper, our engineer will dig out around pad/copper about 0.2mm-0.25mm, otherwise the metal potion will be flowed into the hole and it becomes a PTH. (there will be no copper dig out optimization for single board)."

# TODO: new rule for plated slots: min diameter/width 0.5mm
# JLCPCB: "The minimum plated slot width is 0.5mm, which is drawn with a pad."

# TODO new rule: non-plated slots: min diameter/width 1.0mm
# JLCPCB: "The minimum Non-Plated Slot Width is 1.0mm, please draw the slot outline in the mechanical layer(GML or GKO)""

(rule "Track width, outer layer (1oz copper)"
(layer outer)
(condition "A.Type == 'track'")
(constraint track_width (min 0.127mm))
)

(rule "Track spacing, outer layer (1oz copper)"
(layer outer)
(condition "A.Type == 'track' && B.Type == A.Type")
(constraint clearance (min 0.127mm))
)

(rule "Track width, inner layer"
(layer inner)
(condition "A.Type == 'track'")
(constraint track_width (min 0.09mm))
)

(rule "Track spacing, inner layer"
(layer inner)
(condition "A.Type == 'track' && B.Type == A.Type")
(constraint clearance (min 0.09mm))
)

(rule "Silkscreen text"
(layer "?.Silkscreen")
(condition "A.Type == 'Text' || A.Type == 'Text Box'")
(constraint text_thickness (min 0.15mm))
(constraint text_height (min 1mm))
)

(rule "Pad to Silkscreen"
(layer outer)
(condition "A.Type == 'pad' && B.Layer == '?.Silkscreen'")
(constraint silk_clearance (min 0.15mm))
)

(rule "Edge (routed) to track clearance"
(condition "A.Type == 'track'")
(constraint edge_clearance (min 0.3mm))
)

#(rule "Edge (v-cut) to track clearance"
# (condition "A.Type == 'track'")
# (constraint edge_clearance (min 0.4mm))
#)

# JLCPCB restrictions ambiguous:
# Illustration: 0.2 mm, 1&2 layer: 0.3 mm, multilayer: "(0.15mm more costly)"
# This rule handles diameter minimum and maximum for ALL holes.
# Other specialized rules handle restrictions (e.g. Via, PTH, NPTH)
(rule "Hole diameter"
(constraint hole_size (min 0.2mm) (max 6.3mm))
)

(rule "Hole (NPTH) diameter"
(condition "!A.isPlated()")
(constraint hole_size (min 0.5mm))
)

# TODO: Hole to board edge ≥ 1 mm. Min. board size 10 × 10 mm
(rule "Hole (castellated) diameter"
(layer outer)
(condition "A.Type == 'pad' && A.Fabrication_Property == 'Castellated pad'")
(constraint hole_size (min 0.6mm))
)

# JLCPCB: "Via diameter should be 0.1mm(0.15mm preferred) larger than Via hole size" (illustration shows diameters for both dimensions)
# JLCPCB: PTH: "The annular ring size will be enlarged to 0.15mm in production."
(rule "Annular ring width (via and PTH)"
(layer outer)
(condition "A.isPlated()")
(constraint annular_width (min 0.075mm))
)

(rule "Clearance: hole to hole (perimeter), different nets"
(layer outer)
(condition "A.Net != B.Net")
(constraint hole_to_hole (min 0.5mm))
)

(rule "Clearance: hole to hole (perimeter), same net"
(layer outer)
(condition "A.Net == B.Net")
(constraint hole_to_hole (min 0.254mm))
)

(rule "Clearance: track to NPTH hole (perimeter)"
# (condition "A.Pad_Type == 'NPTH, mechanical' && B.Type == 'track' && A.Net != B.Net")
(condition "!A.isPlated() && B.Type == 'track' && A.Net != B.Net")
(constraint hole_clearance (min 0.254mm))
)

(rule "Clearance: track to PTH hole perimeter"
(condition "A.isPlated() && B.Type == 'track' && A.Net != B.Net")
(constraint hole_clearance (min 0.33mm))
)

# TODO: try combining with rule "Clearance: PTH to track, different nets"
(rule "Clearance: track to pad"
(condition "A.Type == 'pad' && B.Type == 'track' && A.Net != B.Net")
(constraint clearance (min 0.2mm))
)

(rule "Clearance: pad/via to pad/via"
(layer outer)
# (condition "(A.Type == 'Pad' || A.Type == 'Via') && (B.Type == 'Pad' || B.Type == 'Via') && A.Net != B.Net")
(condition "A.isPlated() && B.isPlated() && A.Net != B.Net")
(constraint clearance (min 0.127mm))
)

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